IEC-60749-25 › Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

IEC-60749-25 - 1ST EDITION - CURRENT


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Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.
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Document Number

IEC 60749-25 Ed. 1.0 b:2003

Revision Level

1ST EDITION

Status

Current

Publication Date

July 1, 2003

Committee Number

47