IEC-60749-3 › Historical Revision Information
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

IEC-60749-3 - 1ST EDITION CORRIGENDUM 1 - SUPERSEDED
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Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types.
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31.080.01 (Semiconductor devices in general)

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Document Number

IEC 60749-3 Ed. 1.0 b Cor.1:2003

Revision Level

1ST EDITION CORRIGENDUM 1

Status

Superseded

Publication Date

Aug. 1, 2003

Committee Number

47