IEC-60749-3 › Historical Revision Information
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection
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Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types.
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31.080.01 (Semiconductor devices in general)
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Document Number
IEC 60749-3 Ed. 1.0 b:2002
Revision Level
1ST EDITION
Status
Superseded
Publication Date
April 1, 2002
Committee Number
47