IEC-61190-1-1 › Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC-61190-1-1
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1ST EDITION
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CURRENT
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Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.
To find similar documents by classification:
31.190 (Electronic component assemblies Including preassembled modules)
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Document Number
IEC 61190-1-1 Ed. 1.0 b:2002
Revision Level
1ST EDITION
Status
Current
Publication Date
March 1, 2002
Committee Number
91