IEC-61191-3 › Historical Revision Information
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
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Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
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31.240 (Mechanical structures for electronic equipment)
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Document Number
IEC 61191-3 Ed. 1.0 b:1998
Revision Level
1ST EDITION
Status
Superseded
Publication Date
Aug. 1, 1998
Committee Number
91