IEC-61967-3 Historical Revision Information
Integrated circuits - Measurement of electromagnetic emissions, 150 KHz to 1 GHz - Part 3: Measurement of radiated emissions - Surface scan method

IEC-61967-3 - 1ST EDITION - SUPERSEDED
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This part of IEC 61967 provides a test procedure which defines a method for evaluating the near electric, magnetic or electromagnetic field components at or near the surface of an integrated circuit (IC). This diagnostic procedure is intended for IC architectural analysis such as floor planning and power distribution optimization. This test procedure is applicable to measurements from an IC mounted on any circuit board that is accessible to the scanning probe. For comparison of surface scan emissions between different ICs, the standardized test board defined in IEC 61967-1 should be used. This technique is capable of providing a detailed pattern of the radio frequency (RF) sources internal to the IC. The resolution of the measurement is determined by the capability of the measurement probe and the precision of the probe positioner. This method is intended for use over the 10 MHz to 1 GHz frequency range. Extended upper frequency limits are possible with existing probe technology but are beyond the scope of this specification. The probe is mechanically scanned according to a programmed pattern in a parallel or perpendicular plane to the IC surface. The data is computer processed to provide a colour- enhanced representation of the field strength at the scan frequency.
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31.200 (Integrated circuits. Microelectronics Including electronic chips, logical and analogue microstructures Microprocessors, see 35.160)

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Document Number

IEC/TS 61967-3 Ed. 1.0 b:2005

Revision Level

1ST EDITION

Status

Superseded

Publication Date

June 1, 2005

Committee Number

47A