Document Center List of Standards on Integrated Circuits. Microelectronics Including Electronic Chips, Logical And Analogue Microstructures Microprocessors, See 35.160
ICS Code 31.200
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The following documents are a part of this series:
ASTM:
- ASTM-E1855 - Standard Test Method for Use of 2N2222A Silicon Bipolar Transistors as Neutron Spectrum Sensors and Displacement Damage Monitors
- ASTM-F1260 - Test Method for Estimating Electromigration Median Time-To-Failure and Sigma of Integrated Circuit Metallizations
- ASTM-F1262M - Standard Guide for Transient Radiation Upset Threshold Testing of Digital Integrated Circuits (Metric) (Withdrawn 2023)
- ASTM-F127 - Definitions of Terms Relating to Relating to Photomasking Technology for Microelectronics (Withdrawn 1992)
- ASTM-F1513 - Standard Specification for Pure Aluminum (Unalloyed) Source Material for Electronic Thin Film Applications
- ASTM-F59 - Method for Identification of Metal Particulate Contamination Found in Electronic and Microelectronic Components and Systems Using the Ring Oven Technique, With Spot Tests (Withdrawn 1994)
- ASTM-F744M - Standard Test Method for Measuring Dose Rate Threshold for Upset of Digital Integrated Circuits (Metric) (Withdrawn 2023)
- ASTM-F773 - Practice for Measuring Dose Rate Response of Linear Integrated Circuits
- ASTM-F773M - Standard Practice for Measuring Dose Rate Response of Linear Integrated Circuits (Metric) (Withdrawn 2023)
- ASTM-F774 - Guide for Analysis of Latchup Susceptibility in Bipolar Integrated Circuits (Withdrawn 1987)
BSI:
- BS-6493-2.1 - Integrated Circuits - General
- BS-9400 - Specification for Integrated Electronic Circuits & Micro-Assemblies of Assessed Qualit
- BS-9450 - Specification for integrated electronic circuits and micro-assemblies of assessed quality (capability approval procedures): generic data and methods of test
- BS-9460 - Rules for the Preparation of Detail Specifications for Integrated Circuits of Assessed
- BS-CECC-90000-1 - Harmonized system of quality assessment for electronic components. Generic specification: monolithic integrated circuits. Internal visual inspection
- BS-CECC-90103 - Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL low power SCHOTTKY circuits, series 54LS, 64LS, 74LS, 84LS
- BS-EN-165000-2 - Film and hybrid integrated circuits
- BS-EN-60747-16-1 - Semiconductor devices
- BS-EN-60747-16-10 - Semiconductor devices
- BS-EN-60747-16-3 - Semiconductor devices
- BS-EN-61523-1 - Delay and power calculation standards
- BS-EN-61523-2 - Delay and power calculation standards
- BS-EN-61943 - Integrated circuits. Manufacturing line approval application guideline
- BS-EN-61964 - Integrated circuits. Memory devices pin configurations
- BS-EN-61967-1 - Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz
- BS-EN-61967-2 - Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz
- BS-EN-61967-4 - Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz
- BS-EN-61967-6 - Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz
- BS-EN-61967-8 - Integrated circuits. Measurement of electromagnetic emissions
- BS-EN-62090 - Product package labels for electronic components using bar code and two- dimensional symbologies
- BS-EN-62132-1 - Integrated circuits. Measurement of electromagnetic immunity
- BS-EN-62132-2 - Integrated circuits. Measurement of electromagnetic immunity
- BS-EN-62132-3 - Integrated circuits. Measurement of electromagnetic immunity, 150 kHz to 1 GHz
- BS-EN-62132-4 - Integrated circuits. Measurement of electromagnetic immunity. 150 kHz to 1 GHz
- BS-EN-62132-5 - Integrated circuits. Measurement of electromagnetic immunity, 150 kHz to 1 GHz
- BS-EN-62132-8 - Integrated circuits. Measurement of electromagnetic immunity
- BS-EN-62215-3 - Integrated circuits. Measurement of impulse immunity
- BS-EN-62228-2 - Integrated circuits. EMC evaluation of transceivers
- BS-EN-62433-2 - EMC IC modelling
- BS-EN-62433-3 - EMC IC modelling
- BS-EN-62433-4 - EMC IC modelling
- BS-EN-IEC-60747-16-7 - Semiconductor devices
- BS-EN-IEC-60747-16-8 - Semiconductor devices
- BS-EN-IEC-61967-1 - Integrated circuits. Measurement of electromagnetic emissions. General conditions and definitions
- BS-EN-IEC-61967-4 - Integrated circuits. Measurement of electromagnetic emissions
- BS-EN-IEC-61967-8 - Integrated circuits. Measurement of electromagnetic emissions
- BS-EN-IEC-62228-1 - Integrated circuits. EMC evaluation of transceivers
- BS-EN-IEC-62228-3 - Integrated circuits. EMC evaluation of transceivers
- BS-EN-IEC-62228-7 - Integrated circuits. EMC evaluation of transceivers
- BS-EN-IEC-62433-1 - EMC IC modelling
- BS-EN-IEC-62433-6 - EMC IC modelling
- BS-IEC-60747-10 - Semiconductor devices
- BS-IEC-60747-4-1 - Semiconductor devices. Discrete devices
- BS-IEC-60747-4-2 - Semiconductor devices. Discrete devices
- BS-IEC-60748-1 - Semiconductor devices. Integrated circuits
- BS-IEC-60748-11 - Semiconductor devices. Integrated circuits
- BS-IEC-60748-2-12 - Semiconductor devices. Integrated circuits. Digital integrated circuits
- BS-IEC-60748-2-20 - Semiconductor devices. Integrated circuits
- BS-IEC-60748-23-1 - Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification
- BS-IEC-60748-23-2 - Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification
- BS-IEC-60748-23-3 - Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification
- BS-IEC-60748-23-4 - Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification
- BS-IEC-60748-23-5 - Semiconductor devices. Integrated circuits
- BS-IEC-60748-4 - Semiconductor devices. Integrated circuits. Interface integrated circuits
- BS-IEC-60748-4-3 - Semiconductor devices. Integrated circuits
- BS-IEC-60748-5 - Semiconductor devices. Integrated circuits. Semicustom integrated circuits
- BS-IEC-61523-1 - Delay and power calculation standards
- BS-IEC-62265 - Advanced library format (ALF) describing integrated circuit (IC) technology, cells and blocks
- BS-IEC-62528 - Standard testability method for embedded core-based integrated circuits
- BS-IEC-63011-1 - Integrated circuits. Three dimensional integrated circuits
- BS-IEC-63011-2 - Integrated circuits. Three dimensional integrated circuits
- BS-IEC-63011-3 - Integrated circuits. Three dimensional integrated circuits
- BS-IEC-63055 - Format for LSI-Package-Board Interoperable design
- BS-QC-760001 - Harmonized system of quality assessment for electronic components. Film and hybrid integrated circuits. Generic specification. Requirements for internal visual inspection
- BS-QC-760100 - Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures
- BS-QC-760101 - Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures
- BS-QC-760200 - Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
- BS-QC-760201 - Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
- DD-ENV-50218 - Description of a parametrized European mini test chip
- DD-ENV-50219 - Description of the reliability test structures of the European mini test chip
- DD-IEC-61967-3 - Integrated circuits. Measurement of electromagnetic emissions, 150 kHzto 1 GHz. Measurement of radiated emissions. Surface scan method
- DD-IEC-62215-2 - Integrated circuits. Measurement of impulse immunity. Synchronous transient injection method
- DD-IEC-62228 - Integrated circuits. EMC evaluation of CAN transceivers
- DD-IEC-62404 - Logic digital integrated circuits. Specification for I/O interface model for integrated circuit (IMIC version 1.3)
- PD-IEC-61352 - Mnemonics and symbols for integrated circuits
- PD-IEC-61967-1-1 - Integrated circuits. Measurement of electromagnetic emissions
- PD-IEC-61967-3 - Integrated circuits. Measurement of electromagnetic emissions
- PD-IEC-61967-4-1 - Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz
- PD-IEC-62132-9 - Integrated circuits. Measurement of electromagnetic immunity
- PD-IEC-62433-2-1 - EMC IC modelling
IEC:
- IEC-1739 - Integrated circuits - Part 1: Procedures for manufacturing line approval and quality management
- IEC-60747-16-10 - Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits
- IEC-60748-1 - Semiconductor devices - Integrated circuits - Part 1: General
- IEC-60748-11-2 - Amendment 2
- IEC-60748-2 - Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits
- IEC-60748-21 - Semiconductor devices - Integrated circuits - Part 21: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures
- IEC-60748-2-11 - Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory
- IEC-60748-21-1 - Semiconductor devices - Integrated circuits - Part 21-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures
- IEC-60748-2-12 - Semiconductor devices - Integrated circuits - part2-12: Digital integrated circuits - Blank detail specification for programmable logic devices (PLDs)
- IEC-60748-22 - Semiconductor devices - Integrated circuits - Part 22: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
- IEC-60748-2-20 - Semiconductor devices - Integrated circuits - Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits
- IEC-60748-22-1 - Semiconductor devices - Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
- IEC-60748-23-1 - Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification
- IEC-60748-23-2 - Semiconductor devices - Integrated circuits - Part 23-2: Hybrid integrated circuits and film structures - Manufacturing line certification - Internal visual inspection and special tests
- IEC-60748-23-3 - Semiconductor devices - Integrated circuits - Part 23-3: Hybrid integrated circuits and film structures - Manufacturing line certification - Manufacturers' self-audit checklist and report
- IEC-60748-23-4 - Semiconductor devices - Integrated circuits - Part 23-4: Hybrid integrated circuits and film structures - Manufacturing line certification - Blank detail specification
- IEC-60748-23-5 - Semiconductor devices - Integrated circuits, Part 23-5: Hybrid integrated circuits and film structures - Manufacturing line certification - Procedure for qualification approval
- IEC-60748-4 - Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits
- IEC-60748-4-3 - Semiconductor devices - Integrated circuits - Part 4-3: Interface integrated circuits - Dynamic criteria for analogue-digital converters (ADC)
- IEC-60748-5 - Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits
- IEC-60828 - Pin Allocations for Microprocessor Systems Using the IEC-603-2 Connector
- IEC-61352 - Mnemonics and symbols for integrated circuits
- IEC-61943 - Integrated circuits - Manufacturing line approval application guideline
- IEC-61944 - Integrated circuits - Manufacturing line approval - Demonstration vehicles
- IEC-61945 - Interated circuits - Manufacturing line approval - Methodology for technology and failure analysis
- IEC-61964 - Integrated circuits - Memory devices pin configurations
- IEC-61967-1 - Integrated circuits - Measurement of electromagnetic emissions - Part 1: General conditions and definitions
- IEC-61967-1-1 - Integrated circuits - Measurement of electromagnetic emissions - Part 1-1: General conditions and definitions - Near-field scan data exchange format
- IEC-61967-3 - Integrated circuits - Measurement of electromagnetic emissions - Part 3: Measurement of radiated emissions - Surface scan method
- IEC-61967-4 - Integrated circuits - Measurement of electromagnetic emissions - Part 4: Measurement of conducted emissions - 1 ohm/150 ohm direct coupling method
- IEC-61967-4-1 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4-1: Measurement of conducted emissions - 1 Ohm/150 Ohm direct coupling method - Application guidance to IEC 61967-4
- IEC-61967-4-AM 1 - Amendment 1 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions - 1 ohm/150 ohm direct coupling method
- IEC-61967-4-RL - Integrated circuits - Measurement of electromagnetic emissions - Part 4: Measurement of conducted emissions - 1 ohm/150 ohm direct coupling method
- IEC-61967-5 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 5: Measurement of conducted emissions - Workbench Faraday Cage method
- IEC-61967-6 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method
- IEC-61967-6-1 - Amendment 1 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method
- IEC-61967-8 - Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method
- IEC-61967-8-RL - Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method
- IEC-62090 - Product package labels for electronic components using bar code and two-dimensional symbologies
- IEC-62132-1 - Integrated circuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitions
- IEC-62132-2 - Integrated circuits - Measurement of electromagnetic immunity - Part 2: Measurement of radiated immunity - TEM cell and wideband TEM cell method
- IEC-62132-3 - Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 3: Bulk current injection (BCI) method
- IEC-62132-4 - Integrated circuits - Measurement of electromagnetic immunity 150 kHz to 1 GHz - Part 4: Direct RF power injection method
- IEC-62132-5 - Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 5: Workbench Faraday cage method
- IEC-62132-8 - Integrated circuits - Measurement of electromagnetic immunity - Part 8: Measurement of radiated immunity - IC stripline method
- IEC-62132-9 - Integrated circuits - Measurement of electromagnetic immunity - Part 9: Measurement of radiated immunity - Surface scan method
- IEC-62215-2 - Integrated circuits - Measurement of impulse immunity - Part 2: Synchronous transient injection method
- IEC-62215-3 - Integrated circuits - Measurement of impulse immunity - Part 3: Non-synchronous transient injection method
- IEC-62228 - Integrated circuits - EMC evaluation of CAN transceivers
- IEC-62228-1 - Integrated circuits - EMC evaluation of transceivers - Part 1: General conditions and definitions
- IEC-62228-2 - Integrated circuits - EMC evaluation of transceivers - Part 2: LIN transceivers
- IEC-62228-3 - Integrated circuits - EMC evaluation of transceivers - Part 3: CAN transceivers
- IEC-62228-7 - Integrated circuits - EMC evaluation of transceivers - Part 7: CXPI transceivers
- IEC-62404 - Logic digital integrated circuits - Specification for I/O interface model for integrated circuit (IMIC version 1.3)
- IEC-62433-1 - EMC IC modelling - Part 1: General modelling framework
- IEC-62433-2 - EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)
- IEC-62433-2-1 - EMC IC modelling - Part 2-1: Theory of black box modelling for conducted emission
- IEC-62433-3 - EMC IC modelling - Part 3: Models of integrated circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE)
- IEC-62433-4 - EMC IC modelling - Part 4: Models of integrated circuits for RF immunity behavioural simulation - Conducted immunity modelling (ICIM-CI)
- IEC-62433-6 - EMC IC modelling - Part 6: Models of integrated circuits for pulse immunity behavioural simulation - Conducted pulse immunity modelling (ICIM-CPI)
- IEC-63011-1 - Integrated circuits - Three dimensional integrated circuits - Part 1: Terminology
- IEC-63011-2 - Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect
- IEC-63011-3 - Integrated circuits - Three dimensional integrated circuits - Part 3: Model and measurement conditions of through-silicon via
- IEC-63055 - Format for LSI-Package-Board Interoperable design
- IEC-748-11 - Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
- IEC-748-11-1 - Semiconductor devices - Integrated circuits - Part 11 - Section 1: Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
- IEC-748-11-AM1 - Amendment No. 1
- IEC-748-20 - Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
- IEC-748-20-1 - Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: Requirements for internal visual examination
- IEC-748-20-AM1 - Amendment No. 1 to IEC 748-20
- IEC-748-2-1 - Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section One: Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)
- IEC-748-2-10 - Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 10: Blank detail specification for integrated circuit dynamic read/write memories
- IEC-748-2-2 - Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section two: Family specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54/74 HCU
- IEC-748-2-2-1 - Amendment No. 1
- IEC-748-2-3 - Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section three: Blank detail specification for HCMOS digital integrated circuits (series 54/74 HC, 54/74 HCT, 54/74 HCU)
- IEC-748-2-4 - Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section four: Family specification for complementary MOS digital integrated circuits, series 4000 B and 4000 UB
- IEC-748-2-5 - Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section five: Blank detail specification for complementary MOS digital integrated circuits (series 4000 B and 4000 UB)
- IEC-748-2-6 - Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section Six: Blank detail specification for microprocessor integrated circuits
- IEC-748-2-7 - Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section seven: Blank detail specification for integrated circuit fusible-link programmable bipolar read-only memories
- IEC-748-2-8 - Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section Eight: Blank detail specification for integrated circuit static read/write memories
- IEC-748-2-9 - Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 9: Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories
- IEC-748-3 - Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits
- IEC-748-3-1 - Semiconductor devices. Integrated circuits - Part 3: Analogue integrated circuits - Section one: Blank detail specification for monolithic integrated operational amplifiers
- IEC-748-3-AM1 - Amendment No. 1
- IEC-748-3-AM2 - Amendment No. 2
- IEC-748-4-1 - Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 1: Blank detail specification for linear digital-to-analogue converters (DAC)
- IEC-748-4-2 - Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 2: Blank detail specification for linear analogue-to-digital converters (ADC)
- IEC-828 - Pin Allocations for Microprocessor Systems Using the IEC-603-2 Connector
- IEC/PAS-62119 - Generic Requirements for Implementation of Product Manufacturing Description Data & Transf
- IEC/PAS-62123 - Performance Guide, Manual for Single-& Double-Sided Flexibleprinted Wiring Boards
- IEC/PAS-62307 - Test Method for the Measurement of Moisture Diffusivity & Water Solubility in Organic Mate
Other SDOs:
- EN-60747-16-1 - Discrete Semiconductor Devices & Integrated Circuits, Microwave Integrated Circuits, A
- EN-60747-16-10 - Semiconductor Devices, Technology Approval Schedule (Tas) for Monolithic Microwave Int
- EN-60747-16-3 - Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
- EN-61967-4 - Measurement of Conducted Emissions. 1 Ohm/150 Ohm Direct Coupling Method
- EN-61967-6 - Part 6: Measurement of Conducted Emissions - Magnetic Probe Method (IEC-61967-6:2002
- EN-61967-8 - Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method
- EN-62090 - Product package labels for electronic components using bar code and two- dimensional symbologies
- EN-62132-1 - Integrated circuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitions
- EN-62132-2 - Integrated circuits - Measurement of electromagnetic immunity - Part 2: Measurement of radiated immunity - TEM cell and wideband TEM cell method
- EN-62132-3 - Integrated Circuits, Measurement of Electromagnetic Immunity, 150 Khz To 1 Ghz, Bulk C
- EN-62132-4 - Integrated Circuits, Measurement of Electromagnetic Immunity, 150 Khz To 1 Ghz, Direct
- EN-62132-8 - Integrated circuits - Measurement of electromagnetic immunity - Part 8: Measurement of radiated immunity - IC stripline method
- EN-62215-3 - Integrated circuits - Measurement of impulse immunity - Part 3: Non-synchronous transient injection method
- EN-62228-2 - Integrated circuits - EMC evaluation of transceivers - Part 2: LIN transceivers
- EN-62433-2 - EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)
- EN-62433-3 - EMC IC modelling. Models of integrated Circuits for EMI behavioural simulation. Radiated emissions modelling (ICEM-RE)
- EN-62433-4 - EMC IC modelling - Part 4: Models of integrated circuits for RF immunity behavioural simulation - Conducted immunity modelling (ICIM-CI)
- EN-IEC-61967-1 - Integrated circuits - Measurement of electromagnetic emissions - Part 1: General conditions and definitions (IEC 61967-1:2018)
- EN-IEC-62228-1 - Integrated circuits - EMC evaluation of transceivers - Part 1: General conditions and definitions
- EN-IEC-62228-3 - Integrated circuits - EMC evaluation of transceivers - Part 3: CAN transceivers (IEC 62228-3:2019)
- EN-IEC-62433-1 - EMC IC modelling - Part 1: General modelling framework (IEC 62433-1:2019)