IEC-62878-2-5 › Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
IEC-62878-2-5
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EDITION 1.0
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CURRENT
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IEC 62878-2-5:2019(E) specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material.
This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for transferring information among printed board designers, printed board simulation engineer, manufacturers, and assemblers.
IEC 62878-2-5:2019 applies to substrates using organic material. It neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as M-type business model in IEC 62421.
To find similar documents by classification:
31.180 (Printed circuits and boards)
31.190 (Electronic component assemblies Including preassembled modules)
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Document Number
IEC 62878-2-5 Ed. 1.0 en:2019
Revision Level
EDITION 1.0
Status
Current
Publication Date
Sept. 1, 2019
Committee Number
91