IPC/EIA-J-STD-030 › Complete Document History
Selection and Application of Underfill Material for Flip Chip and Other Micropackages
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RENUMBERED SEE - IPC-J-STD-030 - March 1, 2014
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Obsolete Revision Information: |
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REVISION A - Selection and Application of Board Level Underfill Materials - March 1, 2014
BASE - Selection and Application of Underfill Material - Sept. 1, 2005 |