IPC/EIA-J-STD-030 › Historical Revision Information
Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages

IPC/EIA-J-STD-030 - BASE - SUPERSEDED -- See the following: IPC-J-STD-030
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Selection and Application of Underfill Material for Flip Chip and Other Micropackages


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Document Number

J-STD-030

Revision Level

BASE

Status

Superseded

Publication Date

Sept. 1, 2005

Page Count

33 pages