MIL-PRF-31032/1 › Complete Document History
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
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REVISION D/AM 4 - REVISION D WITH AMENDMENT 4 INTERFILED - July 21, 2022
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Obsolete Revision Information: |
REVISION D/AM 3 - REVISION D WITH AMENDMENT 3 INTERFILED - March 1, 2020
REVISION D/AM 2 - REVISION D WITH AMENDMENT 2 INTERFILED - July 11, 2018
REVISION D/AM 1 - REVISION D WITH AMENDMENT 1 INTERFILED - Jan. 7, 2018
REVISION D - Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting - June 1, 2017
REVISION C/AM 2 - REVISION C/AMENDMENT 2 INTERFILED - June 21, 2013
REVISION C/AM 1 - REVISION C/AMENDMENT 1 INTERFILED - Nov. 1, 2012
REVISION C - WITHOUT BLIND & BURIED PLATED-THROUGH HOLES, FOR SOLDERED PA - May 23, 2010
REVISION B/AM 4 - REV B/AMENDMENT 4 INTERFILED - July 4, 2009
REVISION B/AM 3 - REV B/AMENDMENT 3 INTERFILED - April 15, 2008
REVISION B/AM 2 - REV B/AMENDMENT 2 INTERFILED - Nov. 28, 2006
REVISION B/AM 1 - REV B/AMENDMENT 1 INTERFILED - Feb. 24, 2006
REVISION B - WITHOUT BLIND & BURIED PLATED - Oct. 29, 2004
BASE - PRINTED WIRING BOARD, RIGID, M - Nov. 1, 1995
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