MIL-PRF-31032/1 › Historical Revision Information
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-through Holes, for Soldered Part Mounting

MIL-PRF-31032/1 - REVISION C/AM 2 - SUPERSEDED
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Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting


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FSC 5998 (Electrical and Electronic assemblies, Boards, Cards, and Associated Hardware)

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Document Number

MIL-PRF-31032/1

Revision Level

REVISION C/AM 2

Status

Superseded

Publication Date

June 21, 2013

Page Count

36 pages