NAS-4123 › Complete Document History
Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (Dip)

Complete Current Edition:
   REVISION 2 - Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (Dip) - Jan. 31, 2024

Obsolete Revision Information:
   REVISION 1 - REAFFIRMED IN 2016 - March 30, 2012
   DOD ADOPTION - FYI ONLY: DOD ADOPTED - March 27, 1995
   BASE - HEAT SINK, ELECTRICAL-ELECTRON - Jan. 1, 1995