NAS-4123 › Historical Revision Information
Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (Dip)
Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (Dip)
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FSC 5999 (Miscellaneous Electrical and Electronic Components)
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Document Number
NAS-4123
Revision Level
REVISION 1
Status
Superseded
Publication Date
March 30, 2012
Page Count
16 pages