PD-IEC/PAS-62878-2-5 › Historical Revision Information
Device embedding assembly technology. Guidelines. Implementation of a 3D data format for device embedded substrate.

PD-IEC/PAS-62878-2-5 - REPLACED BY BS-EN-IEC-62878-2-5 - SUPERSEDED
Show Complete Document History

Document Center Inc. is an authorized dealer of BSI standards.
The following bibliographic material is provided to assist you with your purchasing decision:

Device embedded substrate. Guidelines. Data format

Keywords

Substrates (insulating);Structures;Electric connectors;Components;Electronic equipment and components

To find similar documents by classification:

31.180 (Printed circuits and boards)

31.190 (Electronic component assemblies Including preassembled modules)

This document comes with our free Notification Service, good for the life of the document.

This document is available in either Paper or PDF format.

ORDER



Document Number

PD-IEC/PAS-62878-2-5

Revision Level

REPLACED BY BS-EN-IEC-62878-2-5

Status

Superseded

Publication Date

Nov. 18, 2019

International Equivalent

IEC PAS 62878-2-5:2015

Committee Number

EPL/501