ASTM-B490 › Historical Revision Information
Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits
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Scope
1.1 This practice describes a procedure for measuring the ductility of electrodeposited foils.
1.2 This practice is suitable only for the evaluation of electrodeposits having low ductility.
1.3 The obtained ductility values must only be considered semi-quantitative because this test has a significant operator dependence.
1.4 This practice is best used for in-house process control where measurements are always made by the same operator. A change in ductility value can be used as an indication of possible changes in the electroplating solution.
1.5 This standard does not purport to address the safety problems, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
Keywords
Bend testing-coatings; electrodeposited foils-ductility, by micrometer bend method, practice,; Ductility; ductility of electrodeposits, micrometer test,; Electrodeposited coatings; ductility, of electrodeposited foils, by micrometer bend test,; practice,; Foil; electrodeposited, ductility by micrometer bend test, practice,; Micrometer bend test; ductility of electrodeposited foils, practice; ICS Number Code 17.040.20 (Properties of surfaces); 25.220.40 (Metallic coatings)
To find similar documents by ASTM Volume:
02.05 (Metallic and Inorganic Coatings; Metal Powders and Metal Powder Products)
To find similar documents by classification:
17.040.20 (Properties of surfaces)
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Document Number
ASTM-B490-92(1998)
Revision Level
1992 R98 EDITION
Status
Superseded
Modification Type
Reapproval
Publication Date
Oct. 30, 1992
Document Type
Practice
Page Count
2 pages
Committee Number
B08.10