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Scope

1.1 This test method provides a standard procedure for nondestructive radiographic examination of semiconductor devices, electronic components, and the materials used for construction of these items. This test method covers the radiographic examination of these items for possible defective conditions such as extraneous material within the sealed case, improper internal connections, voids in materials used for element mounting, or the sealing glass, or physical damage.

1.2 The quality level and acceptance criteria for the specimens being examined shall be specified in the detail drawing, purchase order or contract.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Significance and Use

This test method is useful for determination of voiding in semiconductor element to header mounting material, glass seal, and lid seal areas. It is also useful for examination of the internal cavities of devices for extraneous material, wire dress, and bond placement for unattached elements.

Keywords

electronic devices; nondestructive testing; radiographic; radioscopy; semiconductors; X-Ray

To find similar documents by ASTM Volume:

03.03 (Nondestructive Testing)

To find similar documents by classification:

31.080.01 (Semiconductor devices in general)

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