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1.1 This practice provides the minimum requirements for nondestructive radiologic examination of semiconductor devices, microelectronic devices, electromagnetic devices, electronic and electrical devices, and the materials used for construction of these items.

1.2 This practice covers the radiologic examination of these items to detect possible defective conditions within the sealed case, especially those resulting from sealing the lid to the case, and internal defects such as extraneous material (foreign objects), improper interconnecting wires, voids in the die attach material or in the glass (when sealing glass is used) or physical damage.

1.3 The values stated in inch-pound units are to be regarded as standard. No other units of measurement are included in this practice.

1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

4.1 This practice establishes the basic minimum parameters and controls for the application of radiological examination of electronic devices. Factors such as device handling, equipment, ESDS, materials, personnel qualification, procedure and quality requirements, reporting, records and radiation sensitivity are addressed. This practice is written so it can be specified on the engineering drawing, specification or contract. It is not a detailed how-to procedure and must be supplemented by a detailed examination technique/procedure (see 9.1).

4.2 This practice does not set limits on radiation dose, but does list requirements to limit and document radiation dose to devices. When radiation dose limits are an issue, the requestor of radiological examinations must be cognizant of this issue and state any maximum radiation dose limitations that are required in the contractual agreement between the using parties.