ASTM-F487 › Historical Revision Information
Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding

ASTM-F487 - 1988 EDITION - SUPERSEDED
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Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding (Withdrawn 2024)
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Scope

1.1 This specification covers aluminum-1% silicon alloy wire for internal connections in semiconductor devices and is limited to wire of diameter up to and including 0.0020 in. (0.051 mm). For diameters larger than 0.0020 in. (0.051 mm), the specifications are to be agreed upon between the purchaser and the supplier.

1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.

Keywords

silicon aluminum wire; wire bonding; ICS Number Code 29.060.10 (Wires)

To find similar documents by ASTM Volume:

10.04 (Electronics; Declarable Substances in Materials; 3D Imaging Systems)

To find similar documents by classification:

29.060.10 (Wires Including electric rods, busbars, etc.)

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Document Number

ASTM-F487-88

Revision Level

1988 EDITION

Status

Superseded

Modification Type

Reapproval

Publication Date

May 27, 1988

Document Type

Specification

Page Count

3 pages

Committee Number

F01.07