ASTM-F487 › Complete Document History
Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding (Withdrawn 2024)


Obsolete Revision Information:
   WITHDRAWN - WITHDRAWN WITHOUT SUPERCEDING - Jan. 5, 2024
   2013 R18 EDITION - REAPPROVED IN 2018 - March 1, 2018
   2013 EDITION - Fine Aluminum - 1% Silicon Wire for Semiconductor Lead-Bondi - Jan. 15, 2013
   1988 R06 EDITION - REAPPROVED IN 2006 - Jan. 1, 2006
   1988 R95(E1) EDITION - EDITORIALLY CORRECTED - June 1, 1995
   1988 R01 EDITION - REAPPROVED IN 2001 - May 27, 1988
   1988 EDITION - Fine Aluminum - 1% Silicon Wire for Semiconductor Lead-Bondi - May 27, 1988
   1982 EDITION - Fine Aluminum - 1% Silicon Wire for Semiconductor Lead-Bondi - Feb. 26, 1982