ASTM-F487 › Historical Revision Information
Standard Specification for Fine Aluminum-1% Silicon Wire for Semiconductor Lead-Bonding
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This specification covers aluminum-1 % silicon alloy wire for semiconductor devices lead-bonding and is limited to wire of diameter up to and including 0.0020 in. (0.051 mm). The wire surface shall be clean and free of finger oils, lubricant residues, stains, and particulate matter. The elongation and breaking load shall be tested to meet the requirements prescribed. The methods in determining the wire dimensions are presented in details. Verify that the chemical requirements are satisfied by means of spectrographic analysis.
Scope
1.1 This specification covers aluminum-1 % silicon alloy wire for internal connections in semiconductor devices and is limited to wire of diameter up to and including 0.0020 in. (0.051 mm). For diameters larger than 0.0020 in. (0.051 mm), the specifications are to be agreed upon between the purchaser and the supplier.
1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.
Keywords
silicon aluminum wire; wire bonding; ICS Number Code 29.060.10 (Wires)
To find similar documents by ASTM Volume:
10.04 (Electronics; Declarable Substances in Materials; 3D Imaging Systems)
To find similar documents by classification:
29.060.10 (Wires Including electric rods, busbars, etc.)
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Document Number
ASTM-F487-88(2006)
Revision Level
1988 R06 EDITION
Status
Superseded
Modification Type
Reapproval
Publication Date
Jan. 1, 2006
Document Type
Specification
Page Count
4 pages
Committee Number
F01.07