ASTM-F487 › Historical Revision Information
Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding (Withdrawn 2024)

ASTM-F487 - WITHDRAWN - CANCELLED
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Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding (Withdrawn 2024)
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Scope

1.1 This specification covers aluminum-1% silicon alloy wire for internal connections in semiconductor devices and is limited to wire of diameter up to and including 0.0020 in. (0.051 mm). For diameters larger than 0.0020 in. (0.051 mm), the specifications are to be agreed upon between the purchaser and the supplier.

1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.

Keywords

silicon aluminum wire; wire bonding; ICS Number Code 29.060.10 (Wires)

To find similar documents by ASTM Volume:

10.04 (Electronics; Declarable Substances in Materials; 3D Imaging Systems)

To find similar documents by classification:

29.060.10 (Wires Including electric rods, busbars, etc.)

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Document Number

ASTM-F487

Revision Level

WITHDRAWN

Status

Cancelled

Modification Type

Reapproval

Publication Date

Jan. 5, 2024

Document Type

Specification

Committee Number

F01.07