BS-EN-60749-15 › Historical Revision Information
Semiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices

BS-EN-60749-15 - REPLACED BY BS-EN-IEC-60749-15 - SUPERSEDED
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Semiconductor devices. Mechanical and climatic test methods

Keywords

Mechanical testing;Solderability testing;Climate;Slots;Destructive testing;Encapsulated;Electronic equipment and components;Holes;Integrated circuits;Semiconductor devices;Thermal testing;Soldering;Environmental testing

To find similar documents by classification:

31.080.01 (Semiconductor devices in general)

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Document Number

BS-EN-60749-15

Revision Level

REPLACED BY BS-EN-IEC-60749-15

Status

Superseded

Publication Date

Oct. 1, 2020

International Equivalent

IEC 60749-15:2003;EN 60749-15:2003

Committee Number

EPL/47