BS-EN-60749-15 › Complete Document History
Semiconductor devices. Mechanical and climatic test methods


Obsolete Revision Information:
   REPLACED BY BS-EN-IEC-60749-15 - WITHDRAWN IN 2020 - Oct. 1, 2020
   2010 EDITION CORRIGENDUM 1 - CORRIGENDUM 1 FOR 2010 EDITION - June 1, 2011
   2010 EDITION - Semiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices - Feb. 28, 2011
   2003 EDITION - TEMPERATURE FOR THROUGH-HOLE M - June 19, 2003