BS-EN-60749-20 › Historical Revision Information
Semiconductor devices. Mechanical and climatic test methods. Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

BS-EN-60749-20 - REPLACED BY BS-EN-IEC-60749-20 - SUPERSEDED
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Semiconductor devices. Mechanical and climatic test methods

Keywords

Encapsulated;Electronic equipment and components;Thermal testing;Environmental testing;Damp-heat tests;Solderability testing;Integrated circuits;Mechanical testing;Plastics;Climate;Surface mounting devices;Soldering;Semiconductor devices

To find similar documents by classification:

31.080.01 (Semiconductor devices in general)

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Document Number

BS-EN-60749-20

Revision Level

REPLACED BY BS-EN-IEC-60749-20

Status

Superseded

Publication Date

Oct. 14, 2020

International Equivalent

IEC 60749-20:2002;EN 60749-20:2003

Committee Number

EPL/47