DD-IEC/PAS-62050 › Historical Revision Information
Board Level Drop Test Method of Components for Handheld Electronic Products

DD-IEC/PAS-62050 - REPLACED BY BS-EN-60749-37 - SUPERSEDED -- See the following: BS-EN-60749-37
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Board level drop test method of components for handheld electronicproduc ts

Keywords

Semiconductor devices;Drop tests;Electronic equipment and components;Printed-circuit boards;Accelerated testing;Mechanical testing;Surface mounting devices;Impact testing

To find similar documents by classification:

31.080.01 (Semiconductor devices in general)

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Document Number

DD-IEC/PAS-62050

Revision Level

REPLACED BY BS-EN-60749-37

Status

Superseded

Publication Date

May 30, 2008

International Equivalent

IEC/PAS 62050:2004

Committee Number

EPL/47