EN-61190-1-2 › Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN-61190-1-2
-
2014 EDITION
-
CURRENT
-- See the following:
BS-EN-61190-1-2
DIN-EN-61190-1-2
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Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
To find similar documents by classification:
31.190 (Electronic component assemblies Including preassembled modules)
Document Number
EN 61190-1-2:2014
Revision Level
2014 EDITION
Status
Current
Publication Date
May 23, 2014