IEC-60191-4 › Historical Revision Information
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC-60191-4
-
2ND EDITION
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SUPERSEDED
-- See the following:
IEC-60191-4-1
IEC-60191-4-2
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IEC 60191-4:2013 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition:
a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use.
To find similar documents by classification:
31.080 (Semiconductor devices Semiconducting materials, see 29.045)
31.080.01 (Semiconductor devices in general)
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Document Number
IEC-60191-4
Revision Level
2ND EDITION
Status
Superseded
Publication Date
Oct. 1, 1999
Committee Number
47D