IEC-60191-4 › Historical Revision Information
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

IEC-60191-4 - EDITION 3.0 - SUPERSEDED -- See the following: IEC-60191-4-1 IEC-60191-4-2
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IEC 60191-4:2013 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition:
a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use.
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To find similar documents by classification:

31.080 (Semiconductor devices Semiconducting materials, see 29.045)

31.080.01 (Semiconductor devices in general)

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Document Number

IEC 60191-4 Ed. 3.0 b:2013

Revision Level

EDITION 3.0

Status

Superseded

Publication Date

Oct. 1, 2013

Committee Number

47D