IEC-60749-3 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

IEC-60749-3 - EDITION 2.0 - CURRENT
Show Complete Document History

Document Center Inc. is an authorized dealer of IEC standards.
The following bibliographic material is provided to assist you with your purchasing decision:

IEC 60749-3:2017(E) is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.
This edition includes the following significant technical changes with respect to the previous edition:
a) reference to the need for ESD protection;
b) inclusion of information on the phenomenon of tin whiskers;
c) inclusion of an optional report form/checklist.




Want this as a site license?

To find similar documents by classification:

31.080.01 (Semiconductor devices in general)

This document comes with our free Notification Service, good for the life of the document.

This document is available in either Paper or PDF format.


Customers who bought this document also bought:

Acceptability of Electronic Assemblies (Hardcopy format)

Acceptability of Printed Boards

Generic Standard on Printed Board Design

Document Number

IEC 60749-3 Ed. 2.0 en:2017

Revision Level




Publication Date

March 1, 2017

Committee Number