IEC-60749-30 › Historical Revision Information
Part 30: Preconditioning of Non-Hermetic Surface Mount Devices Prior To Reliability Te
Document Center Inc. is an authorized dealer of IEC standards.
The following bibliographic material is provided to assist you with your purchasing decision:
The following bibliographic material is provided to assist you with your purchasing decision:
Establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing in order to evaluate long term reliability.
To find similar documents by classification:
31.080.01 (Semiconductor devices in general)
This document comes with our free Notification Service, good for the life of the document.
This document is available in either Paper or PDF format.
Document Number
IEC-60749-30
Revision Level
FOR AMENDMENT 1
Status
Superseded
Publication Date
May 1, 2011
Committee Number
47