IEC-61190-1-2 › Historical Revision Information
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
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IEC 61190-1-2:2014-02(en-fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition:
a) modification of the solder powder size in Table 2;
b) addition of the information of "Reflow condition and profile" in Annex B;
c) addition of a new Annex C.
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31.190 (Electronic component assemblies Including preassembled modules)
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Document Number
IEC 61190-1-2 Ed. 2.0 b:2007
Revision Level
2ND EDITION
Status
Superseded
Publication Date
April 1, 2007
Committee Number
91