IEC-61191-2 › Historical Revision Information
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
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IEC 61191 2 2013 gives the requirements for surface mount solder connections The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies e g through hole chip mounting terminal mounting etc This edition includes the following significant technical changes with respect to the previous edition br IPC A 610 on workmanship has been included as a normative reference br some of the terminology used in the document has been updated br references to IEC standards have been corrected br the use of lead free solder paste and plating are addressed
To find similar documents by classification:
31.190 (Electronic component assemblies Including preassembled modules)
31.240 (Mechanical structures for electronic equipment)
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Document Number
IEC 61191-2 Ed. 1.0 b:1998
Revision Level
1ST EDITION
Status
Superseded
Publication Date
Aug. 1, 1998
Committee Number
91