IEC-62739-1 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing

IEC-62739-1 - EDITION 1.0 - CURRENT

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IEC 62739-1:2013 provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.



To find similar documents by classification:

31.190 (Electronic component assemblies Including preassembled modules)

31.240 (Mechanical structures for electronic equipment)

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Document Number

IEC 62739-1 Ed. 1.0 b:2013

Revision Level




Publication Date

June 18, 2013

Committee Number