IEC-62739-1 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing

IEC-62739-1 - EDITION 1.0 - CURRENT


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IEC 62739-1:2013 provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.
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31.190 (Electronic component assemblies Including preassembled modules)

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Document Number

IEC 62739-1 Ed. 1.0 b:2013

Revision Level

EDITION 1.0

Status

Current

Publication Date

June 18, 2013

Committee Number

91