IEC-62739-1 › Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
IEC-62739-1
-
EDITION 1.0
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CURRENT
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IEC 62739-1:2013 provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.
To find similar documents by classification:
31.190 (Electronic component assemblies Including preassembled modules)
31.240 (Mechanical structures for electronic equipment)
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Document Number
IEC 62739-1 Ed. 1.0 b:2013
Revision Level
EDITION 1.0
Status
Current
Publication Date
June 18, 2013
Committee Number
91