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Scope

1.1 This test method covers the measurement of the threshold level of radiation dose rate that causes upset in digital integrated circuits under static operating conditions. The radiation source is either a flash X-ray machine (FXR) or an electron linear accelerator (LINAC).

1.2 The precision of the measurement depends on the homogeneity of the radiation field and on the precision of the radiation dosimetry and the recording instrumentation.

1.3 The test may be destructive either for further tests or for purposes other than this test if the integrated circuit being tested absorbs a total radiation dose exceeding some predetermined level. Because this level depends both on the kind of integrated circuit and on the application, a specific value must be agreed upon by the parties to the test (6.9).

1.4 Setup, calibration, and test circuit evaluation procedures are included in this test method.

1.5 Procedures for lot qualification and sampling are not included in this test method.

1.6 Because of the variability of the response of different device types, the initial dose rate for any specific test is not given in this test method but must be agreed upon by the parties to the test.

1.7 This standard does not purport to address all of the safety problems, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For more specific hazard statements, see 7.7.2.

Keywords

Circuitry; Current measurement-semiconductors; Destructive testing-semiconductors; Dose rate threshold; Dosimetry; Electrical conductors-semiconductors; Electron linear accelerator; Flash x-ray machines (FXR); Integrated circuits; Irradiance/irradiation-semiconductors; Lasers and laser applications; Linear threshold voltage; Radiation exposure-electronic components/devices; Upset threshold; Voltage; radiation dose rate threshold for determining upset threshold of digital; integrated circuits, test; ICS Number Code 31.200 (Integrated circuits. Microelectronics)

To find similar documents by ASTM Volume:

10.04 (Electronics; Declarable Substances in Materials; 3D Imaging Systems)

To find similar documents by classification:

31.200 (Integrated circuits. Microelectronics Including electronic chips, logical and analogue microstructures Microprocessors, see 35.160)

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